Electromigration Modeling at Circuit Layout Level
Cher Ming Tan, Feifei He
Springer Verlag, Singapore, 2013
66,50 €On orderDelivery: 2-3 weeks
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.
- ISBN-13
- 9789814451208
- ISBN-10
- 9814451207
- Publisher
- Springer Verlag, Singapore
- Year
- 2013
- Publication date
- 2013-05-04
- Pages
- 103
- Dimensions
- 235x155x