Chiplet Design and Heterogeneous Integration Packaging
John H. Lau
Springer Verlag, Singapore, 2023
211,75 €On orderDelivery: 2-3 weeks
- ISBN-13
- 9789811999161
- ISBN-10
- 9811999163
- Publisher
- Springer Verlag, Singapore
- Year
- 2023
- Publication date
- 2023-03-28
- Pages
- 525
- Dimensions
- 162x242x33
- Weight
- 1068