Semiconductor Advanced Packaging
John H. Lau
Springer Verlag, Singapore, 2022
145,75 €On orderDelivery: 2-3 weeks
- ISBN-13
- 9789811613784
- ISBN-10
- 9811613788
- Publisher
- Springer Verlag, Singapore
- Year
- 2022
- Publication date
- 2022-05-19
- Pages
- 498
- Dimensions
- 236x157x31
- Weight
- 800