Assembly and Reliability of Lead-Free Solder Joints
John H. Lau, Ning-Cheng Lee
Springer Verlag, Singapore, 2020
185,50 €On orderDelivery: 2-3 weeks
- ISBN-13
- 9789811539190
- ISBN-10
- 9811539197
- Publisher
- Springer Verlag, Singapore
- Year
- 2020
- Publication date
- 2020-05-30
- Pages
- 527
- Dimensions
- 235x155x