Heterogeneous Integrations
John H. Lau
Springer Verlag, Singapore, 2019
185,50 €On orderDelivery: 2-3 weeks
This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems.
- ISBN-13
- 9789811372230
- ISBN-10
- 9811372233
- Publisher
- Springer Verlag, Singapore
- Year
- 2019
- Publication date
- 2019-04-12
- Pages
- 368
- Dimensions
- 235x155x