Proceedings of the Third International Conference on Microelectronics, Computing and Communication Systems
Springer Verlag, Singapore, 2019
238,25 €On orderDelivery: 2-3 weeks
- ISBN-13
- 9789811370908
- ISBN-10
- 9811370907
- Publisher
- Springer Verlag, Singapore
- Year
- 2019
- Publication date
- 2019-05-24
- Pages
- 669
- Dimensions
- 161x245x42
- Weight
- 1128