Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Jie Cheng
Springer Verlag, Singapore, 2019
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This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material.
- ISBN-13
- 9789811355851
- ISBN-10
- 9811355851
- Publisher
- Springer Verlag, Singapore
- Year
- 2019
- Publication date
- 2019-01-30
- Pages
- 137
- Dimensions
- 235x155x