Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set)

Name: Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set)
Price: 1635.95 EUR
Availability: BackOrder
ISBN: 9789811201110

World Scientific Publishing Co Pte Ltd, 2019

1635,95 €On orderDelivery: 2-3 weeks

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ISBN-13: 9789811201110
ISBN-10: 9811201110
Publisher: World Scientific Publishing Co Pte Ltd
Year: 2019
Publication date: 2019-10-18
Pages: 1080