Fan-Out Wafer-Level Packaging
John H. Lau
Springer Verlag, Singapore, 2018
172,25 €On orderDelivery: 2-3 weeks
This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging.
- ISBN-13
- 9789811088834
- ISBN-10
- 9811088837
- Publisher
- Springer Verlag, Singapore
- Year
- 2018
- Publication date
- 2018-04-13
- Pages
- 303
- Dimensions
- 241x170x27
- Weight
- 660