Electrical Design of Through Silicon Via
Springer, 2016
121,95 €On orderDelivery: 2-3 weeks
This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity.
- ISBN-13
- 9789401779494
- ISBN-10
- 940177949X
- Publisher
- Springer
- Year
- 2016
- Publication date
- 2016-09-27
- Pages
- 280
- Dimensions
- 235x155x