Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
Qingke Zhang
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG, 2016
66,50 €On orderDelivery: 2-3 weeks
This thesispresents a series of mechanical test methods and comprehensively investigatesthe deformation and damage behavior of Cu/Pb-free solder joints under differentloading conditions.
- ISBN-13
- 9783662517253
- ISBN-10
- 3662517256
- Publisher
- Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
- Year
- 2016
- Publication date
- 2016-08-23
- Pages
- 143
- Dimensions
- 235x155x