Testing of Interposer-Based 2.5D Integrated Circuits
Krishnendu Chakrabarty, Ran Wang
Springer International Publishing AG, 2018
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The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.
- ISBN-13
- 9783319854618
- ISBN-10
- 3319854615
- Publisher
- Springer International Publishing AG
- Year
- 2018
- Publication date
- 2018-05-09
- Pages
- 182
- Dimensions
- 235x155x