RF and Microwave Microelectronics Packaging II
Springer International Publishing AG, 2018
145,75 €On orderDelivery: 2-3 weeks
It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics.
- ISBN-13
- 9783319847191
- ISBN-10
- 3319847198
- Publisher
- Springer International Publishing AG
- Year
- 2018
- Publication date
- 2018-06-09
- Pages
- 172
- Dimensions
- 235x155x