Materials for Advanced Packaging
Springer International Publishing AG, 2018
264,50 €On orderDelivery: 2-3 weeks
Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field.
- ISBN-13
- 9783319832098
- ISBN-10
- 3319832093
- Publisher
- Springer International Publishing AG
- Year
- 2018
- Publication date
- 2018-06-08
- Pages
- 969
- Dimensions
- 157x234x55
- Weight
- 1494