3D Microelectronic Packaging
Springer International Publishing AG, 2018
211,75 €On orderDelivery: 2-3 weeks
This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages.
- ISBN-13
- 9783319830865
- ISBN-10
- 3319830864
- Publisher
- Springer International Publishing AG
- Year
- 2018
- Publication date
- 2018-07-13
- Pages
- 463
- Dimensions
- 235x155x