3D Stacked Chips
Springer International Publishing AG, 2018
66,50 €On orderDelivery: 2-3 weeks
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl.
- ISBN-13
- 9783319793054
- ISBN-10
- 3319793055
- Publisher
- Springer International Publishing AG
- Year
- 2018
- Publication date
- 2018-05-26
- Pages
- 339
- Dimensions
- 235x155x