Handbook of Semiconductor Interconnection Technology
Geraldine Cogin Shwartz
Taylor & Francis Inc, 2006
392,75 €On orderDelivery: 2-3 weeks
Describes the equipment used in manufacturing for deposition and etching, such as electrochemical deposition equipment used for plating copper. This book emphasizes the measurement of mechanical and thermal properties as well as the use of EELS, energy filtering TEM, and atomic force microscopy.
- ISBN-13
- 9781574446746
- ISBN-10
- 1574446746
- Publisher
- Taylor & Francis Inc
- Year
- 2006
- Publication date
- 2006-02-22
- Pages
- 536
- Dimensions
- 241x171x
- Weight
- 1112