Wafer-Level Chip-Scale Packaging
Shichun Qu, Yong Liu
Springer-Verlag New York Inc., 2016
185,50 €On orderDelivery: 2-3 weeks
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.
- ISBN-13
- 9781493954384
- ISBN-10
- 1493954385
- Publisher
- Springer-Verlag New York Inc.
- Year
- 2016
- Publication date
- 2016-08-23
- Pages
- 322
- Dimensions
- 156x234x17
- Weight
- 462