Packaging of High Power Semiconductor Lasers
Hui Liu, Lingling Xiong, Wei Zhao, Xingsheng Liu
Springer-Verlag New York Inc., 2014
198,50 €On orderDelivery: 2-3 weeks
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
- ISBN-13
- 9781461492627
- ISBN-10
- 1461492629
- Publisher
- Springer-Verlag New York Inc.
- Year
- 2014
- Publication date
- 2014-07-15
- Pages
- 402
- Dimensions
- 242x159x22
- Weight
- 732