Advanced Materials for Thermal Management of Electronic Packaging
Xingcun Colin, Ph.D. Tong
Springer-Verlag New York Inc., 2011
290,95 €On orderDelivery: 2-3 weeks
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance.
- ISBN-13
- 9781441977588
- ISBN-10
- 1441977589
- Publisher
- Springer-Verlag New York Inc.
- Year
- 2011
- Publication date
- 2011-01-10
- Pages
- 618
- Dimensions
- 242x159x53
- Weight
- 1102