Advanced Flip Chip Packaging
Springer-Verlag New York Inc., 2013
238,25 €On orderDelivery: 2-3 weeks
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes.
- ISBN-13
- 9781441957672
- ISBN-10
- 1441957677
- Publisher
- Springer-Verlag New York Inc.
- Year
- 2013
- Publication date
- 2013-03-21
- Pages
- 560
- Dimensions
- 243x162x26
- Weight
- 922