Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Ephraim (Portland State University, Portland, USA) Suhir
Taylor & Francis Ltd, 2021
259,95 €On orderDelivery: 2-3 weeks
The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.
- ISBN-13
- 9781138624733
- ISBN-10
- 113862473X
- Publisher
- Taylor & Francis Ltd
- Year
- 2021
- Publication date
- 2021-01-28
- Pages
- 382
- Dimensions
- 167x241x31
- Weight
- 754