Advances in Embedded and Fan-Out Wafer Level Packaging Technologies

Name: Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
Price: 165.95 EUR
Availability: BackOrder
ISBN: 9781119314134

John Wiley & Sons Inc, 2019

165,95 €On orderDelivery: 2-3 weeks

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ISBN-13: 9781119314134
ISBN-10: 1119314135
Publisher: John Wiley & Sons Inc
Year: 2019
Publication date: 2019-03-29
Pages: 576
Dimensions: 160x235x33
Weight: 1030