3D Integration in VLSI Circuits
Taylor & Francis Ltd, 2021
99,75 €On orderDelivery: 2-3 weeks
The goal of this book is to provide an understanding of the latest challenges and issues in 3D integration. The term 3D integration includes a variety of integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D I
- ISBN-13
- 9781032095547
- ISBN-10
- 1032095547
- Publisher
- Taylor & Francis Ltd
- Year
- 2021
- Publication date
- 2021-06-30
- Pages
- 234
- Dimensions
- 234x156x
- Weight
- 430