Ceramic Interconnect Technology Handbook
Taylor & Francis Inc, 2007
317,25 €On orderDelivery: 2-3 weeks
Offers coverage of various aspects of ceramic interconnect technologies in electronics and electronic packaging. This book discusses trends in electronic packaging, electrical design, simulation, and testing, ceramic materials, and the various types of ceramic interconnects, devices, and applications.
- ISBN-13
- 9780849335570
- ISBN-10
- 0849335574
- Publisher
- Taylor & Francis Inc
- Year
- 2007
- Publication date
- 2007-01-24
- Pages
- 456
- Dimensions
- 234x156x
- Weight
- 776