Thermal Design of Electronic Equipment
Ralph (Opvista, Irvine, California, USA) Remsburg
Taylor & Francis Inc, 2000
317,25 €On orderDelivery: 2-3 weeks
Presents the formulas used by electronic packaging and thermal engineers. This book presents heat transfer equations dealing with polyalphaolephin, silicone oils, perfluorocarbons, and silicate ester-based liquids. It presents empirical formulas and practical techniques that lets you solve thermal engineering problem in electronic packaging.
- ISBN-13
- 9780849300820
- ISBN-10
- 0849300827
- Publisher
- Taylor & Francis Inc
- Year
- 2000
- Publication date
- 2000-09-27
- Pages
- 396
- Dimensions
- 168x241x28
- Weight
- 732