Hybrid Assemblies and Multichip Modules
Fred W. Kear
Taylor & Francis Inc, 1992
283,95 €On orderDelivery: 2-3 weeks
Offering a description of design considerations from the user's viewpoint, this reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications. It provides an overview of substrate materials and metals used for conductors.
- ISBN-13
- 9780824784669
- ISBN-10
- 0824784669
- Publisher
- Taylor & Francis Inc
- Year
- 1992
- Publication date
- 1992-12-16
- Pages
- 296
- Dimensions
- 234x156x
- Weight
- 635