Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
Karl J. (IBM, East Fishkill, New York, USA) Puttlitz, Kathleen A. (IBM, Fishkill, New York, USA) Stalter
Taylor & Francis Inc, 2004
633,75 €On orderDelivery: 2-3 weeks
Presents a discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. This book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders.
- ISBN-13
- 9780824748708
- ISBN-10
- 0824748700
- Publisher
- Taylor & Francis Inc
- Year
- 2004
- Publication date
- 2004-02-27
- Pages
- 1044
- Dimensions
- 181x261x64
- Weight
- 2140