Modeling and Simulation for Microelectronic Packaging Assembly
Shen (Huazhong University of Science and Technology, Wuhan, Hubei, China) Liu, Yong Liu
John Wiley & Sons Inc, 2011
156,25 €On orderDelivery: 2-3 weeks
An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.
- ISBN-13
- 9780470827802
- ISBN-10
- 0470827807
- Publisher
- John Wiley & Sons Inc
- Year
- 2011
- Publication date
- 2011-10-21
- Pages
- 576
- Dimensions
- 252x175x36
- Weight
- 1134