Electrical Conductive Adhesives with Nanotechnologies
C.P. Wong, Daniel Lu, Yi (Grace) Li
Springer-Verlag New York Inc., 2009
198,50 €On orderDelivery: 2-3 weeks
“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives).
- ISBN-13
- 9780387887821
- ISBN-10
- 0387887822
- Publisher
- Springer-Verlag New York Inc.
- Year
- 2009
- Publication date
- 2009-10-16
- Pages
- 437
- Dimensions
- 243x165x33
- Weight
- 822