Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
Xing-Chang Wei
Taylor & Francis Ltd, 2020
81,50 €On orderDelivery: 2-3 weeks
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power
- ISBN-13
- 9780367573669
- ISBN-10
- 0367573660
- Publisher
- Taylor & Francis Ltd
- Year
- 2020
- Publication date
- 2020-06-30
- Pages
- 322
- Dimensions
- 234x156x
- Weight
- 453