Materials for High-Density Electronic Packaging and Interconnection
Commission on Engineering and Technical Systems, Committee on Materials for High-Density Electronic Packaging, Division on Engineering and Physical Sciences, National Materials Advisory Board, National Research Council
National Academies Press, 1990
184,50 €On orderDelivery: 2-3 weeks
- ISBN-13
- 9780309042338
- ISBN-10
- 030904233X
- Publisher
- National Academies Press
- Year
- 1990
- Publication date
- 1990-01-01
- Pages
- 156
- Dimensions
- 279x216x25
- Weight
- 301